Methods of forming semiconductor device assemblies and interconnect structures, and related semiconductor device assemblies and interconnect structures

ABSTRACT

A method of forming a semiconductor device assembly comprises forming on a first substrate, at least one bond pad comprising a first nickel material over the first substrate, a first copper material on the first nickel material, and a solder-wetting material on the first copper material. On a second substrate is formed at least one conductive pillar comprising a second nickel material, a second copper material directly contacting the second nickel material, and a solder material directly contacting the second copper material. The solder-wetting material is contacted with the solder material. The first copper material, the solder-wetting material, the second copper material, and the solder material are converted into a substantially homogeneous intermetallic compound interconnect structure. Additional methods, semiconductor device assemblies, and interconnect structures are also described.

TECHNICAL FIELD

The disclosure, in various embodiments, relates generally to the fieldof semiconductor device design and fabrication. More specifically, thedisclosure relates to methods of forming semiconductor device assembliesand interconnect structures, and to related semiconductor deviceassemblies and interconnect structures.

BACKGROUND

Semiconductor dice containing integrated circuits can be interconnected(e.g., attached, bonded, joined, coupled) with other semiconductor dice(in singulated form as well as in wafer or partial wafer form),interposers, circuit boards, and other higher-level packaging, toelectrically and physically connect the integrated circuits thereof. Forexample, a semiconductor die including conductive structures (e.g.,studs, columns, pillars) protruding from at least one surface thereof(e.g., a front side surface) may be inverted (e.g., flipped upsidedown), the conductive structures may be aligned with other conductivestructures (e.g., pads, bumps) protruding from at least one surface(e.g., a back side surface) of another semiconductor die, and theconductive structures and other conductive structures may be attached toone another. Multiple semiconductor dice may be stacked upon one anotherin this manner to form a stacked semiconductor device assembly.

Conventionally, a solder material may be utilized to accomplish theelectrical interconnection of semiconductor dice, while also providing aphysical interconnection. The solder material may, for example, be inthe form of a solder mass (e.g., ball, bump, layer) supported by aportion of at least one conductive structure of a semiconductor dieand/or by a portion of at least one conductive structure of anothersemiconductor die positioned for attachment to the semiconductor die.The solder material may be reflowed to form at least one interconnectstructure between the semiconductor die and the other semiconductor diethat attaches the semiconductor die and the another semiconductor die toone another. The interconnect structure may comprise a bulk solderinterconnect (BSI) structure or intermetallic compound (IMC)interconnect structure.

BSI structures include structures wherein a solder material has not beensubstantially converted into an IMC. For example, a BSI structure maycomprise a structure substantially formed of and including unconvertedsolder material, or may comprise a structure formed of and includingunconverted solder material and at least one IMC (e.g., unconvertedsolder material disposed between opposing regions of an IMC).Unfortunately, BSI structures can exhibit problems that may inhibit thereliability, performance, and durability of semiconductor devicestructures including the BSI structures. For example, during and/orafter the formation of a BSI structure, the solder material may slump oreven wick beyond peripheral boundaries of at least one conductivestructure (e.g., pillar, bond pad) associated therewith, weakening thestrength of the attachment between the interconnected semiconductordice. In addition, the solder material of the BSI structure mayundesirably facilitate the formation of voids (e.g., Kirkendall voids atan interface of the solder material and another material) after theformation of the BSI structure due to atomic migration and electronsweep.

IMC interconnect structures include structures wherein a solder materialhas been substantially (e.g., completely) converted into an IMC. IMCinterconnect structures alleviate many of the problems associated withBSI structures (e.g., solder slumping, some post-formation interfacialvoid generation). Unfortunately, however, conventional methods offorming IMC interconnect structures can be impractical and/or may resultin other defects that inhibit the reliability, performance, anddurability of semiconductor device structures including the IMCinterconnect structures. For example, conventional formation methodsutilizing nickel diffusion into a tin-based solder material (e.g., toform a nickel-tin IMC interconnect structure) can be prohibitivelytime-consuming due to the very slow diffusion rate of nickel. As anotherexample, conventional formation methods utilizing copper diffusion intoa tin-based solder material (e.g., to form a copper-tin IMC interconnectstructure), while significantly faster than formation methods utilizingnickel diffusion into a tin-based solder material due to the relativelyrapid diffusion rate of copper, can result in the formation voids (e.g.,Kirkendall voids at an interface of the IMC interconnect structure andremaining copper material). Such voids are due at least to theconversion of Cu₆Sn₅ intermetallic into Cu₃Sn intermetallic and extratin atoms and the availability of additional copper (e.g., from theremaining copper material) for rapid diffusion into the IMC interconnectstructure and to react with the extra tin atoms.

It would, therefore, be desirable to have improved methods andstructures that facilitate the interconnection of semiconductor dicewhile mitigating one or more of the problems conventionally associatedwith such interconnection.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are cross-sectional views illustrating different processstages and structures for a method of forming a semiconductor deviceassembly, in accordance with an embodiment of the disclosure.

FIG. 2 is a schematic side elevation view of a semiconductor deviceassembly including IMC interconnect structures between stackedsubstrates, in accordance with an embodiment of the disclosure.

DETAILED DESCRIPTION

Methods of forming semiconductor device assemblies are disclosed, as aresemiconductor device assemblies, methods of forming interconnectstructures, and interconnect structures. In some embodiments, a methodof forming a semiconductor device assembly comprises forming a firstsemiconductor die including at least one conductive structure (e.g.,bond pad) overlying a first substrate, forming a second semiconductordie including at least one other conductive structure (e.g., conductivepillar) underlying a second substrate, aligning the conductive structureand the other conductive structure, and converting portions of theconductive structure and the other conductive structure into asubstantially homogeneous IMC interconnect structure. The conductivestructure may include a first conductive material over the firstsubstrate, a first nickel material over the first conductive material, afirst copper material over the first nickel material, and asolder-wetting material over the first copper material. The otherconductive structure may include a second conductive material under thesecond substrate, a second nickel material under the second conductivematerial, a second copper material under the second nickel material, anda solder material under the second copper material. The compositions andthicknesses of the first copper material, the second copper material,the solder-wetting material, and the solder material are selected (e.g.,controlled) to form the IMC interconnect structure through acopper-supply-limited diffusion and reaction process that substantiallycompletely converts the first copper material, the second coppermaterial, the solder-wetting material, and the solder material. Inaddition, the first nickel material and the second nickel material areselected and employed to substantially inhibit (e.g., prevent) theundesired diffusion of additional copper (e.g., copper beyond thatprovided by the combination of the first copper material, the secondcopper material, the solder-wetting material, and the solder material)into the solder material and/or the resulting IMC interconnectstructure. Controlling the amounts of copper available to be diffusedinto and react with solder material facilitates the rapid formation ofthe IMC interconnect structure without the substantial formation ofdefects (e.g., voids) at interfaces between the IMC interconnectstructure and other materials. The methods disclosed herein mayfacilitate the formation of interconnect structures, semiconductordevice structures, semiconductor device assemblies, and semiconductordevices exhibiting increased reliability, performance, and durability.

The following description provides specific details, such as materialcompositions and processing conditions, in order to provide a thoroughdescription of embodiments of the present disclosure. However, a personof ordinary skill in the art would understand that the embodiments ofthe present disclosure may be practiced without employing these specificdetails. Indeed, the embodiments of the present disclosure may bepracticed in conjunction with conventional semiconductor fabricationtechniques employed in the industry. In addition, the descriptionprovided below does not form a complete process flow for manufacturing asemiconductor device. The semiconductor device structures describedbelow do not form a complete semiconductor device. Only those processacts and structures necessary to understand the embodiments of thepresent disclosure are described in detail below. Additional acts toform a complete semiconductor device from the semiconductor devicestructures may be performed by conventional fabrication techniques.

Drawings presented herein are for illustrative purposes only, and arenot meant to be actual views of any particular material, component,structure, device, or system. Variations from the shapes depicted in thedrawings as a result, for example, of manufacturing techniques and/ortolerances, are to be expected. Thus, embodiments described herein arenot to be construed as being limited to the particular shapes or regionsas illustrated, but include deviations in shapes that result, forexample, from manufacturing. For example, a region illustrated ordescribed as box-shaped may have rough and/or nonlinear features, and aregion illustrated or described as round may include some rough and/orlinear features. Moreover, sharp angles that are illustrated may berounded, and vice versa. Thus, the regions illustrated in the figuresare schematic in nature, and their shapes are not intended to illustratethe precise shape of a region and do not limit the scope of the presentclaims. The drawings are not necessarily to scale. Additionally,elements common between figures may retain the same numericaldesignation.

As used herein, the singular forms “a,” “an,” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise.

As used herein, “and/or” includes any and all combinations of one ormore of the associated listed items.

As used herein, spatially relative terms, such as “beneath,” “below,”“lower,” “bottom,” “above,” “upper,” “top,” “front,” “rear,” “left,”“right,” and the like, may be used for ease of description to describeone element's or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. Unless otherwise specified,the spatially relative terms are intended to encompass differentorientations of the materials in addition to the orientation depicted inthe figures. For example, if materials in the figures are inverted,elements described as “below” or “beneath” or “under” or “on bottom of”other elements or features would then be oriented “above” or “on top of”the other elements or features. Thus, the term “below” can encompassboth an orientation of above and below, depending on the context inwhich the term is used, which will be evident to one of ordinary skillin the art. The materials may be otherwise oriented (e.g., rotated 90degrees, inverted, flipped) and the spatially relative descriptors usedherein interpreted accordingly.

As used herein, the term “substantially” in reference to a givenparameter, property, or condition means and includes to a degree thatone of ordinary skill in the art would understand that the givenparameter, property, or condition is met with a degree of variance, suchas within acceptable manufacturing tolerances. By way of example,depending on the particular parameter, property, or condition that issubstantially met, the parameter, property, or condition may be at least90.0% met, at least 95.0% met, at least 99.0% met, or even at least99.9% met.

As used herein, the term “substrate” means and includes a base materialor construction upon which additional materials are formed. Thesubstrate may be a semiconductor substrate, a base semiconductor layeron a supporting structure, a metal electrode, or a semiconductorsubstrate having one or more layers, structures or regions formedthereon. The substrate may be a conventional silicon substrate or otherbulk substrate comprising a layer of semiconductive material. As usedherein, the term “bulk substrate” means and includes not only siliconwafers, but also silicon-on-insulator (SOI) substrates, such assilicon-on-sapphire (SOS) substrates and silicon-on-glass (SOG)substrates, epitaxial layers of silicon on a base semiconductorfoundation, and other semiconductor or optoelectronic materials, such assilicon-germanium, germanium, gallium arsenide, gallium nitride, andindium phosphide. The substrate may be doped or undoped. By way ofnon-limiting example, a substrate may comprise at least one of silicon,silicon dioxide, silicon with native oxide, silicon nitride, acarbon-containing silicon nitride, glass, semiconductor, metal oxide,metal, a titanium nitride, a carbon-containing titanium nitride,tantalum, a tantalum nitride, a carbon-containing tantalum nitride,niobium, a niobium nitride, a carbon-containing niobium nitride,molybdenum, a molybdenum nitride, a carbon-containing molybdenumnitride, tungsten, a tungsten nitride, a carbon-containing tungstennitride, copper, cobalt, nickel, iron, aluminum, and a noble metal.

FIGS. 1A and 1B are simplified partial cross-sectional viewsillustrating embodiments of a method of forming a semiconductor deviceassembly, such as a semiconductor die assembly for a hybrid memory cube(HMC). Referring to FIG. 1A, a first semiconductor die 100 may bebrought into proximity with a second semiconductor die 200. The firstsemiconductor die 100 may include a first substrate 102 having an uppersurface 114 (e.g., a front side surface) and a lower surface 116 (e.g.,a back side surface), and at least one bond pad 104 overlying the uppersurface 114 of the first substrate 102. The second semiconductor die 200may include a second substrate 202 having an upper surface 216 (e.g., aflipped back side surface) and a lower surface 214 (e.g., a flippedfront side surface), and at least one conductive pillar 204 underlyingthe lower surface 214 of the second substrate 202. The conductive pillar204 of the second semiconductor die 200 overlies the bond pad 104 of thefirst semiconductor die 100. The conductive pillar 204 of the secondsemiconductor die 200 may be substantially aligned with the bond pad 104of the first semiconductor die 100 (e.g., side surfaces of theconductive pillar 204 may be substantially coplanar with side surfacesof the bond pad 104).

While various embodiments herein are described and illustrated forclarity in the context of the first semiconductor die 100 including asingle bond pad 104 and the second semiconductor die 200 including asingle conductive pillar 204 aligned with the single bond pad 104 of thefirst semiconductor die 100, the first semiconductor die 100 and thesecond semiconductor die 200 may, in practice and as is conventional,include a number of bond pads 104 and conductive pillars 204,respectively. For example, the first semiconductor die 100 may includemultiple (e.g., a plurality of) bond pads 104 and the secondsemiconductor die 200 may include multiple (e.g., a plurality of)conductive pillars 204, wherein each conductive pillar 204 of the secondsemiconductor die 200 is substantially aligned with an associated bondpad 104 of the first semiconductor die 100 thereunder.

The bond pad 104 of the first semiconductor die 100 may include a firstconductive material 106 on or over the first substrate 102, a firstnickel material 108 on or over the first conductive material 106, afirst copper material 110 on or over the first nickel material 108, anda solder-wetting material 112 on or over the first copper material 110.As shown in FIG. 1A, side surfaces (e.g., sidewalls) of the firstconductive material 106, the first nickel material 108, the first coppermaterial 110, and the solder-wetting material 112 may be substantiallycoplanar with one another. The bond pad 104 may be in directcommunication with integrated circuitry in, on, over, and/or under thefirst substrate 102.

The first conductive material 106 may be foamed of and include anyelectrically conductive material including, but not limited to, a metal,a metal alloy, a conductive metal-containing material (e.g., aconductive metal nitride, a conductive metal silicide, a conductivemetal carbide, a conductive metal oxide), a conductively-dopedsemiconductor material (e.g., conductively-doped silicon,conductively-doped germanium, conductively-doped silicon germanium), orcombinations thereof. The first conductive material 106 may, forexample, be fanned of and include at least one element of one or more ofGroups VIII and IB of the Periodic Table of Elements (e.g., copper,silver, gold, cobalt, ruthenium). By way of non-limiting example, thefirst conductive material 106 may be formed of and include a coppermaterial, such as elemental copper (e.g., electrolytic copper), a copperalloy (e.g., an electroless copper), another conductivecopper-containing material, or a combination thereof. In someembodiments, the first conductive material 106 is substantially formedof and includes electrolytic copper. The first conductive material 106may have any desired thickness, such as a thickness within a range offrom about 1 micrometer (μm) to about 100 μm. In some embodiments, thethickness of the first conductive material 106 is about 2 μm.

The first nickel material 108 may be formed of and include anynickel-containing material compatible with the formation of an IMCinterconnect structure thereon, as described in further detail below. Asused herein, the term “compatible” means and includes a material thatdoes not react with, break down, or absorb another material in anunintended way, and that also does not impair the chemical and/ormechanical properties of the another material in an unintended way. Forexample, the first nickel material 108 may be formed of and includeelemental nickel (e.g., electrolytic nickel), a nickel alloy (e.g., anickel-vanadium alloy), another conductive nickel-containing material,or a combination thereof. In some embodiments, the first nickel material108 is substantially formed of and includes electrolytic nickel. Thefirst nickel material 108 may have any desired thickness, such as athickness within a range of from about 1 μm to about 100 μm.

The first copper material 110 may be formed of and include anycopper-containing material compatible with the formation of an IMCinterconnect structure partially therefrom, as described in furtherdetail below. For example, the first copper material 110 may be formedof and include elemental copper (e.g., electrolytic copper), a copperalloy (e.g., electroless copper), another conductive copper-containingmaterial, or a combination thereof. The first copper material 110 may beselected to have a sufficient amount of copper to facilitate the rapidand complete formation of an IMC interconnect structure formed of andincluding a tin-copper IMC (e.g., Cu₆Sn₅ intermetallic) through acopper-supply-limited diffusion and reaction process between at leastthe first copper material 110, a solder material 212 (described below)of the conductive pillar 204, and a second copper material 210(described below) of the conductive pillar 204. In some embodiments, thefirst copper material 110 is substantially formed of and includeselectrolytic copper.

The solder-wetting material 112 may be formed of and include anymaterial permitting the solder material 212 of the conductive pillar 204to wet the bond pad 104 during reflow of the solder material 212, andthat is compatible with the formation of an IMC interconnect structurepartially therefrom, as described in further detail below. By way ofnon-limiting example, the solder-wetting material 112 may be formed ofand include at least one of silver, gold, copper, palladium, titanium,platinum, tin, alloys thereof, or combinations thereof. In someembodiments, the solder-wetting material 112 is formed of at least oneof gold and palladium. The solder-wetting material 112 may act as awetting agent for the solder material 212, may discourage oxidation ofthe solder material 212 during reflow, and may reduce surface tension ofthe solder material 212 during reflow to increase the flowabilitythereof. In embodiments wherein the solder-wetting material 112 isformed of and includes at least one of tin (e.g., elemental tin, a tinalloy, another tin-containing material, a combination thereof) andcopper (e.g., a copper alloy, such as a tin-copper alloy), thesolder-wetting material 112 may also serve as a source of tin and/orcopper to facilitate the rapid and complete formation of an IMCinterconnect structure formed of and including a tin-copper IMC (e.g.,Cu₆Sn₅intermetallic) through a copper-supply-limited diffusion andreaction process between the solder-wetting material 112, the firstcopper material 110, the solder material 212 of the conductive pillar204, and the solder material 212 of the conductive pillar 204. In someembodiments, the solder-wetting material 112 is substantially formed ofand includes a tin alloy (e.g., a tin-silver alloy, a tin-copper alloy).In additional embodiments, the solder-wetting material 112 issubstantially formed of and includes elemental tin (e.g., substantiallypure tin).

With continued reference to FIG. 1A, the conductive pillar 204 of thesecond semiconductor die 200 may include a second conductive material206 under (e.g., directly under) the second substrate 202, a secondnickel material 208 under (e.g., directly under) the second conductivematerial 206, the second copper material 210 under (e.g., directlyunder) the second nickel material 208, and the solder material 212 under(e.g., directly under) the second copper material 210. As shown in FIG.1A, side surfaces (e.g., sidewalls) of the second conductive material206, the second nickel material 208, the second copper material 210, andthe solder material 212 may be substantially coplanar with one another.The conductive pillar 204 may be in direct communication with integratedcircuitry in, on, over, and/or under the second substrate 202.

The second conductive material 206 may be formed of and include anyelectrically conductive material including, but not limited to, a metal,a metal alloy, a conductive metal-containing material (e.g., aconductive metal nitride, a conductive metal silicide, a conductivemetal carbide, a conductive metal oxide), a conductively-dopedsemiconductor material (e.g., conductively-doped silicon,conductively-doped germanium, conductively-doped silicon germanium), orcombinations thereof. The second conductive material 206 may, forexample, be formed of and include at least one element of one or more ofGroups VIII and IB of the Periodic Table of Elements (e.g., copper,silver, gold, cobalt, ruthenium). By way of non-limiting example, thesecond conductive material 206 may be formed of and include a coppermaterial, such as elemental copper (e.g., electrolytic copper), a copperalloy (e.g., an electroless copper), another conductivecopper-containing material, or a combination thereof. The secondconductive material 206 may be the same as or may be different than thefirst conductive material 106 of the bond pad 104 of the firstsemiconductor die 100. In some embodiments, the second conductivematerial 206 is substantially formed of and includes electrolyticcopper. The second conductive material 206 may have any desiredthickness, such as a thickness within a range of from about 1 μm toabout 100 μm. The thickness of the second conductive material 206 may bethe same as or may be different than the thickness of the firstconductive material 106 of the bond pad 104 of the first semiconductordie 100.

The second nickel material 208 may be formed of and include anynickel-containing material compatible with the formation of an IMCinterconnect structure thereunder (e.g., directly thereunder), asdescribed in further detail below. For example, the second nickelmaterial 208 may be formed of and include elemental nickel (e.g.,electrolytic nickel), a nickel alloy (e.g., a nickel-vanadium alloy),another conductive nickel-containing material, or a combination thereof.The second nickel material 208 may be the same as or may be differentthan the first nickel material 108 of the bond pad 104 of the firstsemiconductor die 100. In some embodiments, the second nickel material208 is substantially formed of and includes electrolytic nickel. Thesecond nickel material 208 may have any desired thickness, such as athickness within a range of from about 1 μm to about 100 μm. Thethickness of the second nickel material 208 may be the same as or may bedifferent than the thickness of the first nickel material 108 of thebond pad 104 of the first semiconductor die 100.

The second copper material 210 may be formed of and include anycopper-containing material compatible with the formation of an IMCinterconnect structure partially therefrom, as described in furtherdetail below. For example, the second copper material 210 may be formedof and include elemental copper (e.g., electrolytic copper), a copperalloy (e.g., electroless copper), another conductive copper-containingmaterial, or a combination thereof. The second copper material 210 maybe the same as or may be different than the first copper material 110 ofthe bond pad 104 of the first semiconductor die 100. Similar to thefirst copper material 110 of the bond pad 104, the second coppermaterial 210 may be selected to have a sufficient amount of copper tofacilitate the rapid and complete formation of an IMC interconnectstructure formed of and including a tin-copper IMC (e.g., Cu₆Sn₅intermetallic) through a copper-supply-limited diffusion and reactionprocess at least between the second copper material 210, the soldermaterial 212, and the first copper material 110 of the bond pad 104. Insome embodiments, the second copper material 210 is substantially formedof and includes electrolytic copper.

The solder material 212 may be formed of and include any tin-containingmaterial compatible with the formation of an IMC interconnect structurepartially therefrom, as described in further detail below. For example,the solder material 212 may be formed of and include elemental tin, atin alloy (e.g., tin-silver alloy, a tin-silver-copper alloy, atin-silver-antimony alloy, a tin-silver-zinc alloy, a tin-zinc alloy, atin-zinc-indium alloy, a tin-indium alloy, a tin-gold alloy, a tin-leadalloy, a tin-lead-copper alloy, a tin-bismuth-indium alloy), anothertin-containing material, or a combination thereof. The solder material212 may be selected to have a sufficient amount of tin to facilitate therapid and complete formation of an IMC interconnect structure formed ofand including a tin-copper IMC (e.g., Cu₆Sn₅ intermetallic) through acopper-supply-limited reaction process at least between the soldermaterial 212, the second copper material 210, and the first coppermaterial 110 of the bond pad 104. In some embodiments, the soldermaterial 212 is substantially formed of and includes a tin-silver alloyhaving a tin content of greater than or equal to about 90 percent byweight (wt %), such as greater than or equal to about 93 wt %, orgreater than or equal to about 96 wt %. For example, the solder material212 may be substantially formed of and include tin-silver eutectic(about 96.5 wt % tin, and about 3.5 wt % silver). In additionalembodiments, the solder material 212 is substantially formed of andincludes elemental tin (e.g., substantially pure tin).

The thicknesses of the first copper material 110 of the bond pad 104,the solder-wetting material 112 of the bond pad 104, the second coppermaterial 210 of the conductive pillar 204, and the solder material 212of the conductive pillar 204 may be selected in conjunction with thematerial compositions thereof to facilitate the conversion of the firstcopper material 110, the solder-wetting material 112, the second coppermaterial 210, and the solder material 212 into an IMC interconnectstructure. For example, for given material compositions of the firstcopper material 110, the solder-wetting material 112, the second coppermaterial 210, and the solder material 212, a thickness T₁ of the firstcopper material 110, a thickness T₂ of the solder-wetting material 112,a thickness T₃ of the second copper material 210, and a thickness T₄ ofthe solder material 212 may be selected relative to one another suchthat a limited amount of copper (e.g., supplied at least by the firstcopper material 110 and the second copper material 210) is introduced to(e.g., is diffused into) and reacts with tin (e.g., of at least thesolder material 212) to form a IMC interconnect structure substantiallyformed of and including a tin-copper IMC. The thicknesses of the firstcopper material 110, the solder-wetting material 112, the second coppermaterial 210, and the solder material 212 may be controlled, based onthe copper and tin content thereof, to preclude either a substantialexcess or a substantial deficiency of the amounts of copper and tinnecessary to convert the first copper material 110, the solder-wettingmaterial 112, the second copper material 210, and the solder material212 into a substantially homogeneous IMC interconnect structure formedof and including Cu₆Sn₅ intermetallic, as described in further detailbelow.

As a non-limiting example, at least in embodiments wherein the firstcopper material 110 and the second copper material 210 each compriseelectrolytic copper, the solder material 212 comprises greater than orequal to about 96 wt % tin (e.g., elemental tin, a tin-silver alloy),and the solder-wetting material 112 comprises a material substantiallyfree of tin and copper (e.g., a material formed of and including atleast one of silver, gold, titanium, platinum, palladium), the sum ofthe thickness T₁ of the first copper material 110 and the thickness T₃of the second copper material 210 may be equal to about one half (½) ofthe thickness T₄ of the solder material 212. For example, the thicknessT₁ of the first copper material 110 may be about 2.5 μm, the thicknessT₃ of the second copper material 210 may be about 2.5 μm, and thethickness T₄ of the solder material 212 may be about 10.0 μm. Inadditional embodiments, such as in embodiments wherein at least one ofthe first copper material 110 and the second copper material 210 isformed of and includes a copper-containing material other thanelectrolytic copper, wherein the solder material 212 comprises less thanabout 96 wt % tin, and/or wherein the solder-wetting material 112comprises at least one of tin and copper, one or more of the firstcopper material 110, the second copper material 210, and the soldermaterial 212 may exhibit a different thickness so long as the totalamount of copper and tin encompassed by the combination of the firstcopper material 110, the second copper material 210, the solder material212, and the solder-wetting material 112 is sufficient to produce asubstantially homogeneous IMC structure formed of and including Cu₆Sn₅intermetallic.

The first semiconductor die 100, including the first substrate 102 andthe bond pad 104, and the second semiconductor die 200, including thesecond substrate 202 and the conductive pillar 204 may be formed usingconventional processes and conventional processing equipment, which arenot described in detail herein. By way of non-limiting example, thefirst semiconductor die 100 and the second semiconductor die 200 mayeach independently be formed using one or more of conventionaldeposition processes (e.g., physical vapor deposition, such assputtering, evaporation, and/or ionized physical vapor deposition;plasma enhanced physical vapor deposition; chemical vapor deposition;plasma enhanced chemical vapor deposition; atomic layer deposition;plasma enhanced atomic layer deposition; electrolytic plating;electroless plating; spin-coating; dip coating; spray coating; blanketcoating), conventional growth processes (e.g., in situ growthprocesses), conventional photolithography processes, and conventionalmaterial removal processes (e.g., etching processes, such dry etchingand/or wet etching). In addition, the first semiconductor die 100 andthe second semiconductor die 200 may be positioned (e.g., to align thebond pad 104 and the conductive pillar 204) relative to one anotherusing further conventional processes (e.g., die inversion processes, diealignment processes) and further conventional processing equipment,which are also not described in detail herein.

Referring collectively to FIGS. 1A and 1B, at least one attachmentprocess, such at least one thermocompression process, may be used tointerconnect (e.g., attach, bond, couple) the first semiconductor die100 (FIG. 1A) to the second semiconductor die 200 (FIG. 1A) to from asemiconductor device assembly 300 (FIG. 1B). The attachment process mayconvert the first copper material 110 (FIG. 1A), the solder-wettingmaterial 112 (FIG. 1A), the second copper material 210 (FIG. 1A), andthe solder material 212 (FIG. 1A) into an IMC interconnect structure 310(FIG. 1B). As shown in FIG. 1B, the IMC interconnect structure 310 mayextend between and bond the first nickel material 108 of the bond pad104 (FIG. 1A) of the first semiconductor die 100 and the second nickelmaterial 208 of the conductive pillar (FIG. 1A) of the secondsemiconductor die 200. The IMC interconnect structure 310 may directlyphysically contact each of the first nickel material 108 and the secondnickel material 208.

The attachment process may include physically contacting the bond pad104 of the first semiconductor die 100 with the conductive pillar 204 ofthe second semiconductor die 200, and heating the bond pad 104 and theconductive pillar 204 to at least one temperature sufficient tofacilitate the diffusion of the copper of the first copper material 110and the second copper material 210 into the solder material 212. Thecopper diffused in to the solder material 212 may react with the tin ofthe solder material 212 to form the IMC interconnect structure 310. Thetemperature utilized in attachment process may be selected based on thematerial composition of each of the first copper material 110, thesolder-wetting material 112, the second copper material 210, and thesolder material 212 to facilitate the rapid diffusion of the copper intothe solder material 212. The temperature employed in attachment processmay, for example, be selected to facilitate an average copper diffusionrate of greater than or equal to about 0.25 micrometer/minute (μm/min),such as greater than or equal to about 0.35 μm/min, greater than orequal to about 0.45 μm/min, greater than or equal to about 0.55 μm/min,greater than or equal to about 0.65 μm/min, greater than or equal toabout 0.75 μm/min, greater than or equal to about 0.85 μm/min, greaterthan or equal to about 0.95 μm/min, greater than or equal to about 1.00μm/min, or greater than or equal to about 1.10 μm/min. By way ofnon-limiting example, the attachment process may employ at least onetemperature within a range of from about 200° C. to about 350° C. toform the IMC interconnect structure 310, such as a temperature within arange of from about 210° C. to about 325° C., from about 220° C. toabout 300° C., or from about 230° C. to about 275° C. In someembodiments, each of the first copper material 110 and the second coppermaterial 210 comprises electrolytic copper, the solder material 212comprises at least one of tin-silver eutectic and substantiallyelemental tin (e.g., substantially pure tin), and the thermocompressionprocess employs a temperature of greater than or equal to about 250° C.(e.g., greater than or equal to about 260° C., greater than or equal toabout 270° C.) to consume (e.g., diffuse and react) substantially all ofthe copper of the first copper material 110 and the second coppermaterial 210 and form the IMC interconnect structure 310.

As the copper of each of the first copper material 110 and the secondcopper material 210 diffuses into the solder material 212, Cu₆Sn₅intermetallic and Cu₃Sn intermetallic may each be formed based ontin-copper reaction kinetics and thermodynamics. Accordingly, theattachment process may result in the formation of an initial IMCinterconnect structure formed of an including Cu₆Sn₅ intermetallic andCu₃Sn intermetallic. Upon the formation of the initial IMC interconnectstructure, the Cu₆Sn₅ intermetallic thereof may at least partiallyconvert to Cu₃Sn according to the following chemical equation:

Cu₆Sn₅

2Cu₃Sn+3Sn   (1)

Conventionally, the three (3) tin atoms produced through reaction ofEquation 1 would effectuate the diffusion of nine (9) additional copperatoms from at least one copper material adjacent the initial IMCinterconnect structure to facilitate the formation of additional Cu₃Snintermetallic. Such effectuated copper diffusion typically results inthe formation of undesirable defects, such as Kirkendal voiding at theinterface of the resulting IMC interconnect structure and the coppermaterial. However, since the first copper material 110 and the secondcopper material 210 are substantially completely consumed (e.g.,diffused and reacted) to form the initial IMC interconnect structure(e.g., such that the initial IMC interconnect structure is disposeddirectly adjacent to and between the first nickel material 108 and thesecond nickel material 208), such additional copper diffusion issubstantially precluded. Consequently, the reaction of Equation 1 mayshift back to the left, resulting in the formation of the IMCinterconnect structure 310 substantially formed of and including Cu₆Sn₅intermetallic. Stated another way, the IMC interconnect structure 310may be substantially free of Cu₃Sn intermetallic (and, hence, may alsobe substantially free of defects, such as interfacial voids,conventionally associated with the formation of Cu₃Sn intermetallic).

The IMC interconnect structure 310 may exhibit a thickness T₅ less thanor equal to the thickness T₄ of the solder material 212, and/or lessthan or equal to about two times (2×) the sum of the thickness T₁ of thefirst copper material 110 and the thickness T₃ of the second coppermaterial 210. By way of non-limiting example, if the thickness T₁ offirst copper material 110 is about 2.5 μm, the thickness T₃ of thesecond copper material 210 is about 2.5 μm, and the thickness T₄ of thesolder material 212 is about 10 μm, the thickness T₅ of the IMCinterconnect structure 310 may essentially be less than or equal toabout 10 μm.

The IMC interconnect structure 310 may be substantially homogeneousthroughout the thickness T₅ thereof. For example, the IMC interconnectstructure 310 may exhibit a substantially uniform (e.g., even)distribution of Cu₆Sn₅ intermetallic throughout the thickness T₅thereof. The IMC interconnect structure 310 may be substantially free ofregions (e.g., portions, agglomerations, pockets) of unreacted tin,unreacted copper, and Cu₃Sn intermetallic. Furthermore, any additionalelements (e.g., elements of the first copper material 110, thesolder-wetting material 112, the second copper material, and/or thesolder material 212 other than copper and tin) may be substantiallyuniformly (e.g., evenly) distributed throughout the thickness T₅ of theIMC interconnect structure 310. By way of non-limiting example, the IMCinterconnect structure 310 may exhibit a substantially uniformdistribution of at least one of silver, gold, palladium, platinum,titanium, zinc, lead, antimony, indium, and bismuth throughout thethickness T₅ thereof. In some embodiments, at least one additionalelement may be present as an atomic substitution for copper in theCu₆Sn₅ intermetallic. The homogeneity of the IMC interconnect structure310 may be substantially undetectable by visual detection, but may bedetectable by conventional spectroscopy or spectrometry techniques.

Thus, in accordance with embodiments of the disclosure, a method offorming a semiconductor device assembly comprises forming on a firstsubstrate, at least one bond pad comprising a first nickel material overthe first substrate, a first copper material on the first nickelmaterial, and a solder-wetting material on the first copper material. Ona second substrate is formed at least one conductive pillar comprising asecond nickel material, a second copper material directly contacting thesecond nickel material, and a solder material directly contacting thesecond copper material. The solder-wetting material is contacted withthe solder material. The first copper material, the solder-wettingmaterial, the second copper material, and the solder material areconverted into a substantially homogeneous intermetallic compoundinterconnect structure. Additional methods, semiconductor deviceassemblies, and interconnect structures are also described.

In addition, in accordance with embodiments of the disclosure, a methodof forming an interconnect structure comprises contacting a conductivestructure with another conductive structure to form a combined structurecomprising a copper material on a nickel material, a solder-wettingmaterial on the copper material, a tin-containing solder material on thesolder-wetting material, another copper material on the tin-containingsolder material, and another nickel material on the another coppermaterial. The combined structure is heated to diffuse substantially allof the copper of the copper material and the another copper materialinto the solder material and form a substantially homogenousdistribution of Cu₆Sn₅ intermetallic on and between the nickel materialand the another nickel material.

Furthermore, an interconnect structure of the disclosure comprises asubstantially homogenous distribution of an intermetallic compoundcomprising copper and tin on and between a nickel material and anothernickel material.

Subsequent reflow(s) of the IMC interconnect structure 310 and/or thesolid state aging of the semiconductor device assembly 300 may result inthe diffusion of at least a portion of the nickel of the first nickelmaterial 108 and the second nickel material 208 into the IMCinterconnect structure 310. The diffusion of the nickel may berelatively slow as compared to the diffusion of the copper of the firstcopper material 110 and the second copper material 210, but the IMCinterconnect structure 310 may ultimately exhibit a substantiallyuniform distribution of the nickel. The diffused nickel may be presentas an atomic substitution for copper in the Cu₆Sn₅ intermetallic. Forexample, following reflow and/or solid state aging, the IMC interconnectstructure 310 may exhibit a substantially uniform distribution of(Cu,Ni)₆Sn₅ intermetallic. The IMC interconnect structure 310 and mayalso be substantially free of (Ni,Cu)₃Sn₄ following such reflow and/orsolid state aging. The diffusion of the nickel into the IMC interconnectstructure 310 may decrease (e.g., reduce) the thicknesses of the firstnickel material 108 and the second nickel material 208, and may increase(e.g., enlarge) the thickness T₅ of the IMC interconnect structure 310.The IMC interconnect structure 310 formed of and including (Cu,Ni)₆Sn₅intermetallic may exhibit substantially smooth (e.g., substantiallyflush, substantially uniform, substantially non-corrugated,substantially non-bumpy) interfacial boundaries with remaining portionsof the first nickel material 108 and the second nickel material 208.

After attaching the first semiconductor die 100 (FIG. 1A) and the secondsemiconductor die 200 (FIG. 1A) to form the semiconductor deviceassembly 300 (FIG. 1B), the semiconductor device assembly 300 may besubjected to additional processing. By way of non-limiting example, anadditional semiconductor die (e.g., a semiconductor die substantiallysimilar to the second semiconductor die 200 depicted in FIG. 1A)including at least one additional conductive pillar (e.g., anotherconductive pillar substantially similar to the conductive pillar 204 ofthe second semiconductor die 200 depicted in FIG. 1A) may be positionedproximate to and aligned with at least one additional bond pad (e.g.,another bond pad substantially similar to the bond pad 104 of the firstsemiconductor die 100 depicted in FIG. 1A) on the upper surface 216(e.g., flipped back side surface) of the second substrate 202. Theadditional bond pad may be formed on the upper surface 216 of the secondsubstrate 202 during processing (e.g., back side processing) of secondsemiconductor die 200 before or after the formation of the semiconductordevice assembly 300. Thereafter, at least one additional attachmentprocess (e.g., another attachment process substantially similar to theattachment process described above in relation to FIG. 1B) may beutilized to interconnect (e.g., attach, bond, couple) the additional dieto the semiconductor device assembly 300. Any number of additional diemay be attached to the semiconductor device assembly 300 by way ofsubstantially similar processing to provide the semiconductor deviceassembly 300 with any desired number of stacked, attached dice. Inaddition, a dielectric underfill material, such as a capillary underfillmaterial, may be introduced between the stacked, attached dice of thesemiconductor device assembly 300.

FIG. 2 depicts a schematic side elevation view of a semiconductor deviceassembly 400 including a plurality of IMC interconnect structures 410bonding (e.g., interconnecting, attaching, coupling) a first substrate402 a, a second substrate 402 b, a third substrate 402 c, and a fourthsubstrate 402 d. Each of the IMC interconnect structures 410 may besubstantially similar to the IMC interconnect structure 310 previouslydescribed in relation to FIG. 1B. As shown in FIG. 2, each of the IMCinterconnect structures 410 may be flanked by a first nickel material408 a and a second nickel material 408 b, which may be flanked by afirst conductive material 406 a and a second conductive material 406 b.The first nickel material 408 a, the second nickel material 408 b, thefirst conductive material 406 a, and the second nickel material 408 bmay be substantially similar to the first nickel material 108, thesecond nickel material 208, the first conductive material 106, and thesecond conductive material 206 previously described in relation to FIG.1A, respectively. An underfill material 414 may encapsulate each of theIMC interconnect structures 410, along with the first nickel material408 a, the second nickel material 408 b, the first conductive material406 a, and the second conductive material 406 b associated therewith. Inaddition, as shown in FIG. 2, the first substrate 402 a at the base ofthe semiconductor device assembly 400 may be of greater lateralperipheral dimension than each of the second substrate 402 b, the thirdsubstrate 402 c, and the fourth substrate 402 d. The second substrate402 b, the third substrate 402 c, and the fourth substrate 402 d mayeach be laterally surrounded by a peripheral collar 418 of encapsulantmaterial in contact with a peripheral edge surface of the firstsubstrate 402 a. In some embodiments, the second substrate 402 b, thethird substrate 402 c, and the fourth substrate 402 d are centered onthe first substrate 402 a. While the semiconductor device assembly 400is described and illustrated for clarity as including four substrates(e.g., the substrates 402 a through 402 d), but the disclosure is not solimited, and fewer or more substrates may be employed. The architectureof semiconductor device assembly 400 is adaptable to a variety ofapplications. As a non-limiting example, for computing applications, thefirst substrate 400 a may comprise a logic controller structure, whilesubstrates 400 b through 400 d may comprise memory structures.

Thus, a semiconductor device assembly of the disclosure comprises afirst substrate, a second substrate overlying the first substrate, andconductive structures extending between the first substrate and thesecond substrate, at least one of the conductive structures comprising afirst nickel material over the first substrate, a substantiallyhomogeneous intermetallic compound interconnect structure comprisingcopper and tin on the first nickel material, and a second nickelmaterial on the substantially homogeneous intermetallic compoundinterconnect structure.

The methods of the disclosure may facilitate the rapid formation of IMCinterconnect structures without the defects typically associated withconventional methods of forming IMC interconnect structures. Forexample, the material composition and structure of the bond pad 104(FIG. 1A) and the conductive pillar 204 (FIG. 1A) may facilitate theformation of an IMC interconnect structure (e.g., the interconnectstructure 310 shown in FIG. 1B) faster than conventional methodsemploying a direct nickel material/tin-based solder material interface,and may also inhibit or prevent any substantial Kirkendall voiding asresults from conventional methods employing a direct coppermaterial/tin-based solder material interface without the use of a nickelmaterial. The IMC interconnect structures and methods of the disclosuremay also avoid the solder slumping and electro-migration reliabilityproblems (e.g., atomic migration and electron sweep) typicallyassociated with the formation and use of BSI structures. In turn,semiconductor device structures (e.g., hybrid memory cubes memory) andsemiconductor devices (hybrid memory cube devices) utilizing thesemiconductor die assemblies (e.g., the semiconductor device assembly300 shown in FIG. 1B, the semiconductor device assembly 400 shown inFIG. 2) and the IMC interconnect structures (e.g., the IMC interconnectstructure 310 shown in FIG. 1B, the IMC interconnect structures 410shown in FIG. 2) of the disclosure may exhibit increased reliability,performance, and durability.

While the disclosure is susceptible to various modifications andalternative forms, specific embodiments have been shown by way ofexample in the drawings and have been described in detail herein.However, the disclosure is not limited to the particular formsdisclosed. Rather, the disclosure is to cover all modifications,equivalents, and alternatives falling within the scope of the followingappended claims and their legal equivalent

1. A method of forming a semiconductor device assembly, comprising:forming on a first substrate, at least one bond pad comprising a firstnickel material over the first substrate, a first copper material on thefirst nickel material, and a solder-wetting material on the first coppermaterial; forming on a second substrate, at least one conductive pillarcomprising a second nickel material, a second copper material directlyunder the second nickel material, and a solder material directly underthe second copper material; contacting the solder-wetting material withthe solder material; and converting the first copper material, thesolder-wetting material, the second copper material, and the soldermaterial into a substantially homogeneous intermetallic compoundinterconnect structure.
 2. The method of claim 1, further comprisingselecting the first copper material, the solder-wetting material, thesecond copper material, and the solder material to collectively compriseamounts of copper and tin for forming the substantially homogeneousintermetallic compound interconnect structure through acopper-supply-limited reaction process.
 3. The method of claim 2,wherein selecting the first copper material, the solder-wettingmaterial, the second copper material, and the solder material tocollectively comprise amounts of copper and tin for forming thesubstantially homogeneous intermetallic compound interconnect structurethrough a copper-supply-limited reaction process comprises: selectingmaterial compositions of first copper material, the solder-wettingmaterial, the second copper material, and the solder material; andselecting thicknesses of the first copper material, the solder-wettingmaterial, the second copper material, and the solder material.
 4. Themethod of claim 3, wherein selecting the material compositions of firstcopper material, the solder-wetting material, the second coppermaterial, and the solder material comprises: selecting the first coppermaterial and the second copper material to each comprise electrolyticcopper; and selecting the solder material to comprise greater than orequal to about 90 percent by weight tin.
 5. The method of claim 3,wherein selecting thicknesses of the first copper material, thesolder-wetting material, the second copper material, and the soldermaterial comprises selecting the first copper material and the secondcopper material to exhibit a combined thickness substantially equal toabout one-half of a thickness of the solder material.
 6. The method ofclaim 5, wherein selecting the first copper material and the secondcopper material to exhibit a combined thickness substantially equal to athickness of the solder material comprises selecting the first coppermaterial and the second copper material to exhibit substantially thesame thickness as one another.
 7. The method of claim 1, whereinconverting the first copper material, the solder-wetting material, thesecond copper material, and the solder material comprises into asubstantially homogeneous intermetallic compound interconnect structurecomprises reflowing the solder material to diffuse substantially all ofthe copper of the first copper material and the second copper materialinto the solder material.
 8. The method of claim 7, wherein reflowingthe solder material comprises heating the solder material to atemperature of greater than or equal to about 200° C. while physicallycontacting the at least one bond pad with the at least one conductivepillar.
 9. The method of claim 1, wherein converting the first coppermaterial, the solder-wetting material, the second copper material, andthe solder material into a substantially homogeneous intermetalliccompound interconnect structure comprises forming the substantiallyhomogeneous intermetallic compound interconnect structure to comprise asubstantially uniform distribution of Cu₆Sn₅ intermetallic throughout athickness thereof.
 10. The method of claim 1, further comprisingdiffusing nickel from the first nickel material and the second nickelmaterial into the substantially homogeneous intermetallic compoundstructure to form (Ni,Cu)₆Sn₅ intermetallic substantially uniformlydistributed throughout a thickness of the substantially homogeneousintermetallic compound structure.
 11. The method of claim 1, whereinconverting the a first copper material, the solder-wetting material, thesecond copper material, and the solder material into a substantiallyhomogeneous intermetallic compound interconnect structure comprisesforming the substantially homogeneous intermetallic compoundinterconnect structure to be substantially free of unreacted tin,unreacted copper, and Cu₃Sn intermetallic. 12.-17. (canceled)
 18. Amethod of forming an interconnect structure, comprising: contacting aconductive structure with another conductive structure to form acombined structure comprising a copper material on a nickel material, asolder-wetting material on the copper material, a tin-containing soldermaterial on the solder-wetting material, another copper material on thetin-containing solder material, and another nickel material on theanother copper material; and heating the combined structure to diffusesubstantially all of the copper of the copper material and the anothercopper material into the solder material and form a substantiallyhomogenous distribution of Cu₆Sn₅ intermetallic on and between thenickel material and the another nickel material.
 19. The method of claim18, further comprising: forming the conductive structure to comprise thenickel material, copper material, and the solder-wetting material; andforming the another conductive structure to comprise the tin-containingsolder material, the another copper material, and the another nickelmaterial.
 20. The method of claim 18, further comprising: forming thecopper material to comprise electrolytic copper; forming thetin-containing solder material to comprise at least one of substantiallypure tin and a tin-silver alloy; and forming the another copper materialto comprise additional electrolytic copper.
 21. The method of claim 18,wherein heating the combined structure to diffuse substantially all ofthe copper of the copper material and the another copper material intothe solder material comprises diffusing the copper into the soldermaterial at an average diffusion rate of greater than or equal to about0.55 micrometer per minute.
 22. The method of claim 18, furthercomprising diffusing a portion of the nickel of the nickel material andthe another nickel material into the Cu₆Sn₅ intermetallic tosubstantially convert the Cu₆Sn₅ intermetallic into (Ni,Cu)₆Sn₅intermetallic.
 23. An interconnect structure comprising a substantiallyhomogenous distribution of an intermetallic compound comprising copperand tin on and between a nickel material and another nickel material.24. The interconnect structure of claim 23, wherein the intermetalliccompound comprises Cu₆Sn₅ intermetallic.
 25. The interconnect structureof claim 23, wherein the intermetallic compound comprises (Ni,Cu)₆Sn₅intermetallic.